Call for Papers

The Symposium encourages submissions in all areas of VLSI Technology and Circuits, including:

• Advanced CMOS Platforms, Interconnect and Backside Power Delivery Network (BSPDN) Technologies
• Advanced Packaging, Chiplet and Heterogeneous Integration Technologies Including 2.5D and 3D
• Analog and Mixed-Signal Circuits
• Beyond CMOS Devices That Utilize New Physics Including Spin, Optical and Quantum Computing
• Biomedical Devices, Circuits, and Systems
• Computing/Processing in Memory
• Data Converters
• Device Physics, Characterization, Modeling and Reliability
• Devices and Accelerators For ML/DL and New Compute
• Digital Circuits, Hardware Security, Signal Integrity, IOs
• DTCO and Design Enablement
• Frequency Generation and Clocking Circuits
• Memory Technologies, Devices, Circuits, and Architectures
• Power Management Devices and Circuits
• Processes and Materials for CMOS Scaling and New Devices
• Processors and SoCs
• Sensors, Imagers, IoT, MEMS, Display Circuits
• Wireless and RF Devices Circuits and Systems
• Wireline and Optical Transceivers, Optical Interconnects and Processors

Papers will be considered on the basis of originality, innovation, and advancing the field. Prototype implementation and measured results will be considered favorably in the ratings.

Requirements:

• Complete paper must occupy no more than three pages including illustrations. Submitted papers which exceed this length will not be accepted for review.
• Each page can contain about 700 words and two illustrations (assuming each illustration is in two-column format). A page could contain as many as six illustrations if they are sized accordingly.
• A page of figures should be Arial font and no smaller than 8 pt size.
• When preparing the final pages, please carefully follow the instructions in the Author’s Guide 8.5×11 or A4.
• Please avoid the use of special international fonts in the main body text, figures, charts, and tables in the paper submission.
• The authors may use the first page for text and the second and third pages for pictures.
• You must have approval from your organization before submitting your paper to the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits. The IEEE/JSAP Symposium on VLSI Technology & Circuits views as an unprofessional practice the withdrawal of a paper once it has been submitted by the author, accepted by the Program Committee, and widely announced in the Advance Program. Withdrawal of a paper or failure to present a paper at the Symposium after the Advance Program is distributed jeopardizes both the Symposium’s credibility and the author’s professional reputation.

Prospective authors must submit paper abstracts with the three-page paper format according to the Symposium guidelines. Accepted papers will be published as submitted with no revisions permitted. Authors must follow detailed instructions provided in the “Authors” section of the website, including the Authors’ Guide and Pre-publication Policy. Students are encouraged to apply to the prestigious Best Student Paper Award. Extended versions of outstanding papers will be invited for publication in the IEEE Transaction on Electron Devices, IEEE Journal of  Solid-State Circuits, and IEEE Solid-State Circuits Letters. 

Validate Your Paper with IEEE eXpress®

All papers to be submitted to 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits should be validated by IEEE PDF eXpress before submission.

First-time users should do the following:

1. Select the “Don’t have an account? Create account“.*
2. Enter the following:    Conference ID: 65830X
   1. Your Email Address
   2. Password
3. Continue to enter information as prompted.

An Online confirmation will be displayed, and an email confirmation will be sent verifying your account setup.

*Previous users of PDF eXpress need to follow the above steps, but should enter the same password that was used for previous conferences. Verify that your contact information is valid.

Upload your source file.  Once the Xplore compliant pdf has been created, you will receive an email. Review the pdf and if it is correct, that is the file that you will upload to the VLSI submission site.   

Contacting PDF eXpress Support

Access the Publications Support Center for IEEE PDF eXpress.

See VLSI Pre-publication Restrictions

A very limited number of late news papers will be accepted until March 30, 2026

Authors are asked to submit late news papers announcing only very recent developments. Papers should be in the same format as a regular paper and should be submitted through the submission web site in the same way as for regular submissions. Authors of accepted papers will be notified by the middle of April.

Student Travel Grant Application

Student presenters must request travel assistance at time of submission. Those that requested assistance will be provided the official request form in April 2026. We have a limited number of student travel grants that are available for SSCS and EDS members. If you have any questions, please email vlsi@vlsisymposium.org.

Student Travel Support Request Form (available April 2026)

Solid State Circuits Student Travel Award Grant Form (available April 2026)

Coming Soon

VLSI Symposium Policy on Pre-Publication

You may confirm or replace your paper (including all information registered on Paper Submission Form) on-line at any time up until the submission deadline, Monday, January 26, 2026, 23:59 PST (Tuesday, January 27, 2026, 07:59 GMT / Tuesday, January 27, 2026, 16:59 JST)

Notification of Review Result
If accepted for presentation, the content of the paper must not be announced or published prior to the Symposium. The Technical Program Committee will review all submitted papers and authors will receive notification of the Committee’s decision around the middle of April 2026.

Copyright Transfer Form
The Copyright Transfer Form must be submitted to the VLSI Secretariat once your paper is accepted. Detailed information will be given in the acceptance letter.

Additional Questions
Authors may contact the Program Chairs for assistance.
VLSI Secretariat, North America and Europe
VLSI Secretariat, Japan and Far East