Media Registration
Registration (in-person or OnDemand) for the media is complimentary. Please contact Chris Burke to request information.
Pre-Publication Guidelines
Prior to the start of the Symposium, the technical content of press releases regarding accepted papers must be limited to the information included in the Symposium Advance Program or the Symposium Media Kit. After the Symposium Proceedings are released on June 9th, press releases on the technical content of the full accepted papers is allowed.
Online Media Briefing
The Symposium organizers are planning an online briefing for the media to discuss the most newsworthy papers and major technology trends in this year’s Symposium program. Details will be available in April 2026.
Media Contacts
NORTH AMERICAN & EU
BTB Integrated Marketing –
Chris Burke, co-Media Relations Director
E-mail: chris.burke@btbmarketing.com
JAPAN & ASIA
Secretariat for VLSI Symposia c/o JTB Communication Design, Inc. Tokyo, Japan
E-mail: vlsisymp@jtbcom.co.jp
2026 IEEE Symposium on VLSI Technology & Circuits Media Kit
Welcome to the Media Center for the Symposium. The following press materials may be downloaded for news coverage of the 2026 IEEE Symposium on VLSI Technology & Circuits.
China
Lead Release
Technical Tipsheet
Technical Terms
Taiwan
Lead Release
Technical Tipsheet
Technical Terms
2026 IEEE SYMPOSIUM ON VLSI TECHNOLOGY NEWS RELEASES
2026 VLSI Call for Workshops News Release
2026 VLSI Call for Papers News Release
2026 IEEE VLSI Symposium Logo
Honolulu, Hawaii Image
2026 IEEE SYMPOSIUM ON VLSI TECHNOLOGY IMAGES AND CAPTIONS
Selected images from the highlighted papers are presented as files of individual high-resolution images.
