Overview

ADVANCING THE AI FRONTIER through VLSI innovation

---

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits will be held as an in-person event with on demand content.

Welcome to the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits. We appreciate your interest in submitting a paper to the Symposium. On this page, you will find all the necessary information and forms for the preparation of your submitted paper. The accepted papers will be included in the Digest of Technical Papers as received, without opportunity for further changes.

Share information with colleagues and students!

Scope

The Symposium encourages submissions in all areas of VLSI Technology and Circuits, including:

• Advanced CMOS Platforms, Interconnect and Backside Power Delivery Network (BSPDN) Technologies
• Advanced Packaging, Chiplet and Heterogeneous Integration Technologies Including 2.5D and 3D
• Analog and Mixed-Signal Circuits
• Beyond CMOS Devices That Utilize New Physics Including Spin, Optical and Quantum Computing
• Biomedical Devices, Circuits, and Systems
• Computing/Processing in Memory
• Data Converters
• Device Physics, Characterization, Modeling and Reliability
• Devices and Accelerators For ML/DL and New Compute
• Digital Circuits, Hardware Security, Signal Integrity, IOs
• DTCO and Design Enablement
• Frequency Generation and Clocking Circuits
• Memory Technologies, Devices, Circuits, and Architectures
• Power Management Devices and Circuits
• Processes and Materials for CMOS Scaling and New Devices
• Processors and SoCs
• Sensors, Imagers, IoT, MEMS, Display Circuits
• Wireless and RF Devices Circuits and Systems
• Wireline and Optical Transceivers, Optical Interconnects and Processors

Additional Questions

Authors may contact the Secretariat for assistance.
VLSI Secretariat, North America and Europe