Newsletter 5
20 most popular on-demand videos are released!
Hurry up to register and don’t miss the increased attention.
The videos can be accessed in symposia website until August 31.
Register Now! On-demand contents now available.
The deadline for online registration is extended to July 31 (23:59 JST).
Technology/Circuits Joint Focus Sessions
| Paper No. | Affiliation | Title |
|---|---|---|
| JFS1-1 (invited) | imec | Design and Technology Solutions for 3D Integrated High Performance Systems |
| JFS5-6 | National Chiao Tung Univ. | Reconfigurable Germanium Quantum-Dot Arrays for CMOS Integratable Quantum Electronic Devices |
| JFS4-1 | Renesas Electronics | A CMOS Image Sensor and an AI Accelerator for Realizing Edge-Computing-Based Surveillance Camera Systems |
| JFS2-1 | KAIST | A 13.7 TFLOPS/W Floating-Point DNN Processor Using Heterogeneous Computing Architecture with Exponent-Computing-in-Memory |
| JFS2-8 | The Univ. of Tokyo | Energy-Efficient Reliable HZO FeFET Computation-in-Memory with Local Multiply & Global Accumulate Array for Source-Follower & Charge-Sharing Voltage Sensing |
Technology Sessions
| Paper No. | Affiliation | Title |
|---|---|---|
| T2-1 | imec | Forksheet FETs for Advanced CMOS Scaling: Forksheet-Nanosheet Co-Integration and Dual Work Function Metal Gates at 17nm N-P Space |
| T8-2 | Macronix | A Novel Micro Wall Heater for Thermally-Assisted 3D AND-Type Flash Memory to Radically Boost the Write/Erase Speed and Endurance for the Applications of Write-Intensive Persistent Memory |
| T5-1 | Samsung Electronics | Super Low-Power Advanced 5nm Extended Platform Technology for Extreme Low Voltage Applications |
| TFS1-1 (invited) | AIST | 3-Dimensional Integration of Epitaxial Magnetic Tunnel Junctions with New Materials for Future MRAM |
| T2-3 | Intel | Advancing Monolayer 2D NMOS and PMOS Transistor Integration From Growth to Van Der Waals Interface Engineering for Ultimate CMOS Scaling |
Circuit Sessions
| Paper No. | Affiliation | Title |
|---|---|---|
| CFS1-2 | Stanford Univ. | CHIMERA: A 0.92 TOPS, 2.2 TOPS/W Edge AI Accelerator with 2 MByte On-Chip Foundry Resistive RAM for Efficient Training and Inference |
| CFS1-1 | Preferred Networks | MN-Core - A Highly Efficient and Scalable Approach to Deep Learning |
| C20-1 | Sogang Univ. | A 0.93-μW Single-Stage Rail-to-Rail Class AB Buffer Amplifier Improving DC Gain and Slew-Rate with Different-Ratio Current-Mirrors and Positive-Feedback Loops |
| C7-1 | Samsung Electronics | 5nm Low Power SRAM Featuring Dual-Rail Architecture with Voltage-Tracking Assist Circuit for 5G Mobile Application |
| C20-2 | KAIST | A 12-bit Mobile OLED/μLED Display Driver IC with Cascaded Loading-Free Capacitive Interpolation DAC and 6.24V/μs-Slew-Rate Buffer Amplifier |
Special Sessions
| Paper No. | Affiliation | Title |
|---|---|---|
| SC1-1 | TSMC | CMOS Device Technology for the Next Decade |
| WS1-1 | Univ. of Texas at Austin | Machine Learning for Agile IC Design and Manufacturing |
| SC1-2 | imec | Nanosheet Device Architectures to Enable CMOS Scaling in 3nm and Beyond: Nanosheet, Forksheet and CFET |
| SC1-6 | Macronix | Emerging Memories and the Applications |
| WS4-1 | Micron | The Power and Limitations of Materials Solutions |
We look forward to seeing you all at 2021 VLSI Symposia!
Sincerely yours,
Shinya Yamakawa, 2021 Technology Symposium Chair, Tomas Palacios, Co-Chair
Katsura Miyashita, 2021 Technology Program Chair, Gosia Jurczak, Co-Chair
Ken Takeuchi, 2021 Circuits Symposium Chair, Brian Ginsburg, Co-Chair
Yusuke Oike, 2021 Circuits Program Chair, Borivoje Nikolić, Co-Chair