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Author's Guide
The deadline for paper submission is
January 23, 2012 at 23:59 (PST)
The submission site for Technology and Circuits is now closed.
Dear Author(s):
Welcome to the 2012 Symposia on VLSI Technology & Circuits. We appreciate
your interest in submitting a paper to the Symposium. On this page, you will find all the necessary information and forms for the
preparation of your submitted paper. The accepted papers will be included in the
Digest of Technical Papers as received, without opportunity for further changes. This year, the Symposia will not be printing the digests, the papers will be handed out on a USB drive.
Before submitting your paper, please read the Pre-publication Policy for the Symposia. Click here for the policy.
*NEW JOINT TECHNOLOGY AND CIRCUITS FOCUS SESSIONS
Joint technology and circuits focus sessions comprising invited and contributed papers will be offered in special areas of joint interest.
- Design in scaled technologies
- Design enablement
- Memory technology and design
- 3D (TSV) and heterogeneous integration
For the Technology Symposium, paper submissions highlighting major innovations and advances in materials, processes, devices, integration, reliability and modeling in these areas are strongly encouraged.
For the Circuits Symposium, paper submissions highlighting major innovations and advances in circuits, designs, tools and methodologies in these joint topic areas are strongly encouraged.
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The 2012 Symposium on VLSI Technology welcomes submission
of papers on all aspects of IC technology. The scope of the symposium
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- New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/Mixed-Signal/High-Voltage, Imager, MEMS, etc.)
- New concepts and breakthroughs in VLSI processes and devices for Memory, Logic, I/O, and I/F
- Advanced gate stacks and interconnects in VLSI processes and devices
- Advanced lithography and fine-patterning technologies for high-density VLSI
- New functional devices beyond CMOS with a path for VLSI implementation
- Packaging of VLSI devices including 3D-system integration
- Advanced device analysis, materials and modeling for VLSIs
- Reliability related to the above devices
- Theory and fundamentals related to the above devices
- New concepts and technologies for VLSI manufacturing
- Heterogeneous integration of non-Si materials/devices on large Si substrates
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The three days of the 2012 Symposium on VLSI Circuits will provide designers of integrated circuits an opportunity to meet and present important new work on all aspects of VLSI circuits. The 2012 Symposium on VLSI Technology (please see the reverse side) will be held at the same location with two days of overlap. A single registration allows participants to attend both of the Symposia, and offers unique opportunities to interact and synergize on topics of joint interest.
The scope of the Symposium includes innovations and advances in the following areas: |
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- RF and wireless communication circuits and architecture, including CMOS RF and mm-wave
- Wireline transceiver and I/O design, spanning chip-to-chip to long-reach applications
- Digital circuit techniques for processor, memory, and complex SOC architectures and implementations
- Clock generation and distribution for high frequency digital and mixed-signal applications
- Analog and mixed signal circuits such as data converters, PLL, amplifiers, and filters
- Digitally-assisted analog and analog-assisted digital circuits, including digital implementations of RF/analog
- Memory circuits and architectures for SRAM, DRAM, and non-volatile, including emerging memories
- Power minimization techniques, circuits for battery management, energy harvesting, and renewable energy
- Power management circuits, including linear and switching voltage regulators and voltage references
- Sensor and display circuits for current and emerging applications, including biomedical and healthcare.
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Papers will be considered on the basis of originality, innovation, and advancing the field. Prototype implementation and measured results will be considered favorably in the ratings.
*Your complete paper must occupy no more than two pages including illustrations.
Submitted papers, which exceed this length, will not
be accepted for review. Each page can contain about 700 words and two illustrations
(assuming each illustration is two-column format). A page could contain
as many as six illustrations if they are sized accordingly.
When preparing the final pages, please follow carefully the instructions in the
Author's Guide. Please avoid the use
of special Asian fonts in the main body text, figures, charts, and tables in
the paper submission.
*You must have approval from your organization before submitting your paper to the VLSI Symposia.
The VLSI Symposia views as an unprofessional practice the withdrawal of a paper once it has been submitted by the author, accepted by the Program Committee, and widely announced in the Advance Program. Withdrawal of a paper or failure to present a paper at the Symposia after the Advance Program is distributed jeopardizes both the Symposia credibility and the author's professional reputation.
In order to insure that your paper receives a complete review, it is imperative
that you read all the following instructions. |
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Below is the link to the Author's Guide that provides a detailed description of camera-ready paper preparation. For 2012, you must NOT create a pdf before you upload to the submission site. You will upload a source file to the submission site and the site will create the Xplore compliant pdf for you. Your file for submission may be one of the following formats; Word (.doc), Word XML Document (.docx), WordPerfect (.wpd), Postscript (.ps), Adobe PDF (.pdf) or, if you have a source file in LaTex, please convert to Adobe PDF (.pdf) before you upload. The file name should end with the appropriate suffix (i.e., "doc".). For example, your file could have a name such as "mypaper.doc".
The paper must be in final form, and if accepted, will be published without any modifications. |
150 Word Abstract
The abstract is a brief synopsis of your paper. It will be used by
the Symposium Technical Program Committee in press releases and
pre-Symposium publicity. The abstract should be typed in the Technical
Paper Submission Form directly. You must enter plain ASCII text
only, and you may not exceed 75 words. Neither tables nor figures
may appear in the abstract.
IMPORTANT: It is important not to wait till the deadline to submit your file since you will need to receive the created pdf of your file and review it. There is always heavy traffic on the submission site around the deadline and it's crucial not to miss the submission deadline because you are waiting for the converted PDF for your approval.
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Paper Submission Deadline
23:59, January 23, 2012 (PST) |
Due to review deadlines, papers received after that date will not be accepted for review.
Copyright Transfer Form
Copyright Transfer Form will be submitted on the submission site, once your paper is accepted. Detailed information will be given in the acceptance letter.
To revise your submissions
To revise an already submitted paper, you should revisit the Technical
Paper Submission Form, enter ID/Password, and make your updates. You
can revise or confirm your submission as many times as you wish up
until the deadline. To cancel your submission, you should inform the
Secretariat in writing.
If accepted for presentation, the content of the paper must
not be announced or published prior to the Symposia. The Technical
Program Committee will review all submitted papers and authors will
receive notification of the Committee's decision around the end of March 2012.
We thank you for your interest in the Symposia on VLSI Technology & Circuits.
If you have any further questions, please do not hesitate to contact
the Conference Office at vlsi@vlsisymposium.org (USA) or vlsisymp@ics-inc.co.jp (Japan) |
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| Symposium on VLSI Technology |
| Klaus Schruefer - Program Chair |
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Toshiro Hiramoto - Program Co-Chair |
| Symposium
on VLSI Circuits |
| Vivek De - Program Chair |
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Hideyuki Kabuo - Program Co-Chair |
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PDF of Author's Guide
Word Document of Author's Guide
